Detecting System
CFW920 nanometer graphics wafer testing equipment Wafer Type: Bare, Taiko, Thin Application: ADI/AEI/Post CMP/ Advanced Packaging/Cutting Path Application field: FAB front process control Product features: yield control, small defect sampling Equipment parameters: Camera: Chengfeng custom high speed high resolution color camera Light source: Chengfeng self-developed Wafer special light and dark field composite light source Pixel resolution: 170 nm@20X Magnification: 2X/5X/10X/20X, 50X/100X Detection power: 1Pixel (AI) Test method: AI/ML Types can be detected: poor graphics, cracks, scratches, needle marks, pits, dirt, foreign bodies, breakage, etc Missing rate: ≤0.001%, low overkill rate
Classification
Wafer visual inspection system
Detecting System
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Visual imaging system
Detecting System
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Passive component inspecting equipment
KLA的缺陷检测与复检视系统支持芯片和晶圆制造环境中各种不同的良率应用，包括进厂工艺设备认证、晶圆认证、研究和开发以及设备、工艺和生产线监控。图案化和非图案化的晶圆缺陷检测与复检系统可以捕获并识别晶圆前后表面以及边缘上的颗粒和图案缺陷，并对其进行分类。该信息将帮助工程师发现、解决并监控关键的良率偏移，从而加快良率提升并达到更高的产品良率。
Passive component inspecting equipment
多行文本内容元素
富文本内容绑定数据后可解析HTML语言内容
Passive component inspecting equipment
KLA的缺陷检测与复检视系统支持芯片和晶圆制造环境中各种不同的良率应用，包括进厂工艺设备认证、晶圆认证、研究和开发以及设备、工艺和生产线监控。图案化和非图案化的晶圆缺陷检测与复检系统可以捕获并识别晶圆前后表面以及边缘上的颗粒和图案缺陷，并对其进行分类。该信息将帮助工程师发现、解决并监控关键的良率偏移，从而加快良率提升并达到更高的产品良率。
Passive component inspecting equipment
多行文本内容元素
富文本内容绑定数据后可解析HTML语言内容
Company address: Building 4, Zhongdian High tech Industrial Park, Keji 7th Road, Tangjiawan Town, High tech Zone, Zhuhai City, Guangdong Province
Company address: Wanlong Building, No. 29 Xinfa Road, Suzhou Industrial Park, Suzhou City, Jiangsu Province
Company address:Comprehensive Protection Building at the Intersection of Dongfang Avenue and Dayu Road in Xinzhan District, Hefei City, Anhui Province
Company address: Building 1, Investment Promotion High tech Network Valley, Donghu High tech Zone, Wuhan City, Hubei Province
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