Classification
CFW820 FAB front section defect detection
Chengfeng Technology focuses on the research and application of nanoscale patterned wafer detection equipment. The founding core members of the company have been deeply involved in the fields of optical design and visual algorithms for over 20 years. Based on our focus and professional genes in the field of semiconductor visual defect detection, our company has a deep accumulation of optical path design and scene detection algorithms. We have specifically designed a series of scene based dual light path dual camera/light and dark field composite light path/laser composite light path solutions for specific sub fields of wafer manufacturing, combined with accumulated scene based AI detection algorithms, benchmarking against global leading technologies, Currently, it has been implemented in various fields such as silicon optical wafers, optical communication lenses, synthetic semiconductors, and digital wafers.
Application scenario: ADI/AEI/Post CMP
5 in 1 multifunctional:
Crystal plane detection, back detection, edge detection, wafer warping measurement, wafer thickness measurement
Applicable fields:
FAB front-end process control
Supports 12 "/8"/6 "wafer
Support Taiko/Shin thinning process
Support wafer flipping function
ADC automatic defect classification
Pixel resolution:
nine hundred and seventy-six nm@5X
Magnification: 1X/2X/5X/10X/20X
Optical imaging technology: light and dark field composite optical path, transparent wafer imaging, fluorescence optical path imaging, infrared penetration imaging.
这里是标题一h1占位文字
CFW820 FAB front section defect detection
Chengfeng Technology focuses on the research and application of nanoscale patterned wafer detection equipment. The founding core members of the company have been deeply involved in the fields of optical design and visual algorithms for over 20 years. Based on our focus and professional genes in the field of semiconductor visual defect detection, our company has a deep accumulation of optical path design and scene detection algorithms. We have specifically designed a series of scene based dual light path dual camera/light and dark field composite light path/laser composite light path solutions for specific sub fields of wafer manufacturing, combined with accumulated scene based AI detection algorithms, benchmarking against global leading technologies, Currently, it has been implemented in various fields such as silicon optical wafers, optical communication lenses, synthetic semiconductors, and digital wafers.
Application scenario: ADI/AEI/Post CMP
5 in 1 multifunctional:
Crystal plane detection, back detection, edge detection, wafer warping measurement, wafer thickness measurement
Applicable fields:
FAB front-end process control
Supports 12 "/8"/6 "wafer
Support Taiko/Shin thinning process
Support wafer flipping function
ADC automatic defect classification
Pixel resolution:
nine hundred and seventy-six nm@5X
Magnification: 1X/2X/5X/10X/20X
Optical imaging technology: light and dark field composite optical path, transparent wafer imaging, fluorescence optical path imaging, infrared penetration imaging.
Company address: Building 4, Zhongdian High tech Industrial Park, Keji 7th Road, Tangjiawan Town, High tech Zone, Zhuhai City, Guangdong Province
Company address: Wanlong Building, No. 29 Xinfa Road, Suzhou Industrial Park, Suzhou City, Jiangsu Province
Company address:Comprehensive Protection Building at the Intersection of Dongfang Avenue and Dayu Road in Xinzhan District, Hefei City, Anhui Province
Company address: Building 1, Investment Promotion High tech Network Valley, Donghu High tech Zone, Wuhan City, Hubei Province
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