Classification
CFW380 FAB rear section defect detection
The CFW380 multifunctional Wafer detection device launched by Chengfeng Technology is suitable for Wafer surface defect detection before and after slicing (supporting cutting path detection). The founding core members of the company have been deeply involved in the fields of optical design and visual algorithms for over 20 years. Based on our focus and professional genes in the field of semiconductor visual defect detection, our company has a deep accumulation of optical path design and scene detection algorithms. We have specifically designed a series of scene based dual optical path dual camera/light and dark field composite optical path/laser composite optical path solutions for specific sub fields of wafer manufacturing, combined with accumulated scene based AI detection algorithms, benchmarking against global leading technologies. Currently, we have been implemented in various fields such as GPP wafers/silicon optical wafers/optical communication lenses/composite semiconductors/digital wafers.
Application scenarios: OQC/detection after cutting/detection after film expansion
Applicable fields:
FAB quality final inspection
Detection after wafer slicing/film expansion
Supports 12 "/8"/6 "wafer
Support wafer/frame/ring
Support wafer flipping function
ADC automatic defect classification
Pixel resolution:
two point four μ M @ 2X
Magnification ratio: 1X/2X/5X
Feature: Rapid screening of defects in the later stage
Optical imaging technology: light and dark field composite optical path, transparent wafer imaging, fluorescence optical path imaging, infrared penetration imaging.
这里是标题一h1占位文字
CFW380 FAB rear section defect detection
The CFW380 multifunctional Wafer detection device launched by Chengfeng Technology is suitable for Wafer surface defect detection before and after slicing (supporting cutting path detection). The founding core members of the company have been deeply involved in the fields of optical design and visual algorithms for over 20 years. Based on our focus and professional genes in the field of semiconductor visual defect detection, our company has a deep accumulation of optical path design and scene detection algorithms. We have specifically designed a series of scene based dual optical path dual camera/light and dark field composite optical path/laser composite optical path solutions for specific sub fields of wafer manufacturing, combined with accumulated scene based AI detection algorithms, benchmarking against global leading technologies. Currently, we have been implemented in various fields such as GPP wafers/silicon optical wafers/optical communication lenses/composite semiconductors/digital wafers.
Application scenarios: OQC/detection after cutting/detection after film expansion
Applicable fields:
FAB quality final inspection
Detection after wafer slicing/film expansion
Supports 12 "/8"/6 "wafer
Support wafer/frame/ring
Support wafer flipping function
ADC automatic defect classification
Pixel resolution:
two point four μ M @ 2X
Magnification ratio: 1X/2X/5X
Feature: Rapid screening of defects in the later stage
Optical imaging technology: light and dark field composite optical path, transparent wafer imaging, fluorescence optical path imaging, infrared penetration imaging.
Company address: Building 4, Zhongdian High tech Industrial Park, Keji 7th Road, Tangjiawan Town, High tech Zone, Zhuhai City, Guangdong Province
Company address: Wanlong Building, No. 29 Xinfa Road, Suzhou Industrial Park, Suzhou City, Jiangsu Province
Company address:Comprehensive Protection Building at the Intersection of Dongfang Avenue and Dayu Road in Xinzhan District, Hefei City, Anhui Province
Company address: Building 1, Investment Promotion High tech Network Valley, Donghu High tech Zone, Wuhan City, Hubei Province
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