Lead Frame Inspecting Equipment
The lead frame visual inspection equipment is specially designed for defect detection during the production of chip supports in the semiconductor industry. Optical imaging, image processing, deep learning and automation technologies are applied to meet all kinds of defect detection during the production of chip supports. The company specially sets up a visual inspection solution laboratory, with advanced visual equipment and professional visual team, the detection software and algorithm independent design to solve customers' visual problems as the core, truly achieve one to one visual solution service.
Applicable fields
Classification
Ram roll type CF-150
Lead Frame Inspecting Equipment
Equipment specification: 760*600*1800mm Equipment weight: 180kg Testing width：21-100mm Detection accuracy: 0.02mm Camera configuration：4*5 million Running speed: 8m/min
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Advantages and characteristics
The software algorithm is independently developed, specially designed for stamping inspection, with high accuracy and low false alarm rate, and it can detect major defects in the frame field such as punch missing/blind hole/burr/dent. The independently designed special light source with the self-developed software algorithm has been widely used in the world's leading enterprises.Applicable fields: LED bracket reel, IC lead frame reel
Ram type plastic seal type CF-330
Lead Frame Inspecting Equipment
Equipment specification: 1776*821*1830mm Equipment weight: 300kg Inspection width: 30-100mm Detection accuracy: 0.02mm Camera configuration: 3 x 9 million Operation speed: 23 pieces/min
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Advantages and characteristics
The light source is designed independently to cover dents/scratches/missing plating/multi-plating/dirty/oxidation/deformation and other defects with high precision, with 2 lighting stations on the front and 1 station on the back. The highest accuracy of CCD can reach 0.02mm, with high speed surface camera, which can adapt to the field environment of complex noise interference. Inspection efficiency: 20-23 pieces per minute. Application range: IC stamping lead frame sheet offline inspection / IC plastic sealing sheet offline inspection.Application area: IC chip frame after plastic sealing
Etching chip type CF-320C
Lead Frame Inspecting Equipment
Equipment specification: 2959 * 1033 * 2158mm Detection accuracy: 0.01mm/pixel Camera configuration: 2 sets of 8K color line scanning cameras Test material width: 55mm~100mm Operating speed: 6-10 tablets/minute
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Advantages and characteristics
The light source is designed independently and can cover scratches/perforations/poor etching/poor semi-etching/residue/dirt/foreign matters and other defects with high accuracy. The software is configured with self-learning interaction function, which can quickly set the acceptance area and range manually. Detection efficiency: 6-10 tablets/minuteApplication range: etching IC lead frame chip detection
Stamped sheet type CF-320B
Lead Frame Inspecting Equipment
Equipment specification: 2959 * 1033 * 2158mm Detection accuracy: 0.02mm/pixel Camera configuration: 3 sets of 12 million color cameras Test material width: 55mm~100mm Operating speed: 17~20 tablets/min
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Advantages and characteristics
The light source is independently designed to cover defects such as dents/scratches/missed plating/excessive plating/dirt/oxidation/deformation with high accuracy. The maximum accuracy of CCD can reach 0.02mm. The software is configured with self-learning interaction function, which can quickly set the allowable area and range manually. Detection efficiency: 17-20 tablets/minuteScope of application: chip inspection of stamping IC lead frame
electroplated roll type CF160
Lead Frame Inspecting Equipment
Equipment specifications: 400 * 880 * 1800mm Detection width: 50-110mm Detection accuracy: 0.04 * 0.04mm Camera configuration: 4 x 5 million Running speed: 8m/min
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Advantages and characteristics
The software algorithm is independently developed and specially designed for frame electroplating detection, with high accuracy and low false alarm rate. It can detect major defects in the frame field such as missed punching/blind hole/missed plating/multiple plating, and is leading in the industry. The self-designed special light source and self-developed software algorithm have been widely used in world-famous head enterprises. Single/double way optional.Application scope: Electroplating process components for lead frames
Passive component inspecting equipment
KLA的缺陷检测与复检视系统支持芯片和晶圆制造环境中各种不同的良率应用，包括进厂工艺设备认证、晶圆认证、研究和开发以及设备、工艺和生产线监控。图案化和非图案化的晶圆缺陷检测与复检系统可以捕获并识别晶圆前后表面以及边缘上的颗粒和图案缺陷，并对其进行分类。该信息将帮助工程师发现、解决并监控关键的良率偏移，从而加快良率提升并达到更高的产品良率。
Passive component inspecting equipment
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Passive component inspecting equipment
KLA的缺陷检测与复检视系统支持芯片和晶圆制造环境中各种不同的良率应用，包括进厂工艺设备认证、晶圆认证、研究和开发以及设备、工艺和生产线监控。图案化和非图案化的晶圆缺陷检测与复检系统可以捕获并识别晶圆前后表面以及边缘上的颗粒和图案缺陷，并对其进行分类。该信息将帮助工程师发现、解决并监控关键的良率偏移，从而加快良率提升并达到更高的产品良率。
Passive component inspecting equipment
多行文本内容元素
富文本内容绑定数据后可解析HTML语言内容
Company address: Building 4, Zhongdian High tech Industrial Park, Keji 7th Road, Tangjiawan Town, High tech Zone, Zhuhai City, Guangdong Province
Company address: Wanlong Building, No. 29 Xinfa Road, Suzhou Industrial Park, Suzhou City, Jiangsu Province
Company address:Comprehensive Protection Building at the Intersection of Dongfang Avenue and Dayu Road in Xinzhan District, Hefei City, Anhui Province
Company address: Building 1, Investment Promotion High tech Network Valley, Donghu High tech Zone, Wuhan City, Hubei Province
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